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D-Wave Quantum Inc. (NYSE: QBTS) Targets Processor Development Scalability with Advanced Cryogenic Packaging Initiative

  • D-Wave launches initiative to develop advanced cryogenic packaging for both gate-model and annealing quantum processors.
  • The program will expand multichip packaging capabilities, manufacturing equipment, and processes.
  • Initiative leverages expertise from NASA’s Jet Propulsion Laboratory (“JPL”) for superconducting bump-bond technology.
  • The goal is to increase interconnectivity and scalability for architectures reaching 100,000 qubits.

D-Wave Quantum Inc. (NYSE: QBTS) (“D-Wave”), a leader in quantum computing systems, software, and services, has announced a strategic development program to expand its capabilities in cryogenic packaging, designed to advance and scale both gate-model and annealing quantum processors. The initiative underscores the company’s focus on hardware innovation to support its long-term technology roadmap (https://ibn.fm/WU30l).

Cryogenic packaging – the housing and interconnection of quantum processor components in extremely low-temperature environments – plays a central role in performance and scalability. In quantum computing, packaging must not only handle ultra-low temperatures but also be compatible with ultra-low magnetic fields and ensure uninterrupted superconductivity from on-chip circuits to external wiring.

According to D-Wave, the new initiative will expand its multichip packaging capabilities, add advanced manufacturing equipment, and refine processes to support the development of larger and more complex quantum processors.

A key element of the effort is D-Wave’s collaboration with NASA’s Jet Propulsion Laboratory (“JPL”), managed by Caltech. The company is incorporating JPL’s superconducting bump-bond process, which allows end-to-end superconducting interconnects between chips. This technology could be essential for both scaling D-Wave’s existing annealing architecture and advancing its fluxonium-based gate-model systems.

D-Wave sees superconducting bump bonds as a potential enabler for higher-density control and better interconnectivity across multichip quantum processor architectures. The ability to maintain superconductivity through these connections is vital for maintaining ultra-low temperature operation and high qubit coherence, both of which are essential for scaling toward error-corrected systems.

Beyond chip-to-chip connections, the initiative will target increases in circuit density for superconducting printed circuit boards (“PCBs”). These boards form the backbone of D-Wave’s quantum systems, and higher-density circuits can help pack more processing power into each system.

Dr. Trevor Lanting, D-Wave’s chief development officer, noted that high-performance packaging is essential for scaling both annealing and gate-model systems. “We believe this strategic initiative will allow us to further extend our leadership position in quantum systems technology development and support our exciting and aggressive product roadmap on the path to 100,000 qubits,” he said.

About D-Wave Quantum Inc.

D-Wave is a leader in the development and delivery of quantum computing systems, software, and services. We are the world’s first commercial supplier of quantum computers, and the only company building both annealing and gate-model quantum computers. Our mission is to help customers realize the value of quantum, today. Our quantum computers — the world’s largest — feature QPUs with sub-second response times and can be deployed on-premises or accessed through our quantum cloud service, which offers 99.9% availability and uptime. More than 100 organizations trust D-Wave with their toughest computational challenges. With over 200 million problems submitted to our quantum systems to date, our customers apply our technology to address use cases spanning optimization, artificial intelligence, research and more. Learn more about realizing the value of quantum computing today and how we’re shaping the quantum-driven industrial and societal advancements of tomorrow: www.dwavequantum.com.

NOTE TO INVESTORS: The latest news and updates relating to QBTS are available in the company’s newsroom at https://ibn.fm/QBTS

Forward Looking Statements

Certain statements in this press release are forward-looking, as defined in the Private Securities Litigation Reform Act of 1995. These statements involve risks, uncertainties, and other factors that may cause actual results to differ materially from the information expressed or implied by these forward-looking statements and may not be indicative of future results. These forward-looking statements are subject to a number of risks and uncertainties, including, among others, various factors beyond management’s control, including the risks set forth under the heading “Risk Factors” discussed under the caption “Item 1A. Risk Factors” in Part I of our most recent Annual Report on Form 10-K or any updates discussed under the caption “Item 1A. Risk Factors” in Part II of our Quarterly Reports on Form 10-Q and in our other filings with the SEC. Undue reliance should not be placed on the forward-looking statements in this press release in making an investment decision, which are based on information available to us on the date hereof. We undertake no duty to update this information unless required by law.

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